AD898
Automatic die bonder
quantity :3 type
·High accuracy with excellent productivity:
· - 320 ms system cycle time
·- ±25.4 μm @ 3 sigma XY placement
· - ±0.5° @ 3 sigma die rotation· Flexible indexing clamp for substrate
· thickness of 0.1 to 2 mm
· Real time epoxy pattern inspection and
· alignment
· Automatic pre-bond and post-bond
·inspection
· Die size range: 10 x 10 to 1000 x 1000 mil
· Automatic wafer handling system to
· handle up to 8" wafer
· Flexible work holder for different
· applications
· Applications include Mini-BGA, Flex BGA,
· CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
·TSSOP, TSOP, SOIC, SOT, PDIP, stacked
· CSP, Image sensor and singulated unit.